Last April we told you that Apple was trying out two different ways to incorporate Force Touch into the screen of the future iPhone 6s. Well, today a new report from China again raises the alarm about the possibility of Cupertino’s boys integrating Force Touch technology into the iPhone 6s .
In terms of memory, it should be noted that Apple first used Force Touch technology in the Apple Watch , thanks to which the device is able to differentiate between a simple touch and a longer touch. In this way, Apple has succeeded in increasing the possibilities of the touch screen with new functions.
On the other hand, we must not forget other concepts of iPhone 7 in which they consider the possibility of using Force Touch. Not only that, they would also do away with the Home button and incorporate it into the touchscreen.
The iPhone 6s could have Force Touch technology
This new report from China states that the next generation iPhone will have a new component that debuted for the first time in the Apple Watch, which would be nothing more than Force Touch technology. In addition, they comment that the component would already be in full production process in the region.
After the clock, the US company has also used Force Touch to integrate it into the trackpad of the new 12-inch MacBook. The possibilities offered by Force Touch are very interesting , so it wouldn’t be bad to be able to see them on iPhone 6s and future generations as well.
With Force Touch, you can activate hidden menus and functions on iPhone 6s by holding your finger on the screen. But this report doesn’t only talk about Force Touch, it also points out that there is a possibility that the iPhone 6s has a module called System-in-Package (SiP) , very similar to the one found inside the Apple Watch.
Will the iPhone 6s have an SiP module like the Apple Watch?
The interior of the S1 System-in-Package (SiP), which contains most of the components that the Watch needs to function, is one of the most interesting things about this device. The S1 i includes things like RAM, ARM processor, NFC, WiFi or Bluetooth , as well as drivers for the touchscreen and other components.
Apple has managed to collect all these components under a single chip encapsulated with a resin that is supposed to be able to protect them from accidental damage , including water. If they were to incorporate the SiP design into future iPhones and iPads, Apple would be able to use the space left over to increase the battery size of these devices, as long as they are able to make the internal components even smaller.
From BGR they comment that according to the report, local suppliers would start the production of these SiP modules for the future iPhone 6s during this month. However, nothing is confirmed yet, so we will have to wait to see if these rumors are true and the iPhone 6s come with Force Touch technology and a SiP module where the most important components of the smartphone will be found.